Technical Program Committee

TPC Co-Chair

TPC MEMBERS

Abdelkader Lahmadi, University of Lorraine, abdelkader.lahmadi@loria.fr
Alberto Egon Schaeffer-Filho, UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL alberto@inf.ufrgs.br
Aldri Luiz dos Santos, UNIVERSIDADE FEDERAL DE MINAS GERAIS, aldri@dcc.ufmg.br
Alexander Clemm, Futurewei Technologies, Inc., ludwig@clemm.org
Alireza Ghasempour, Utah State University, alireza_ghasempour@yahoo.com
Alva L. Couch, Tufts University, alva.couch@tufts.edu
Amjad Gawanmah, University of Dubai, amjad@ece.concordia.ca
Antônio Jorge Gomes Abelém, UNIVERSIDADE FEDERAL DO PARÁ, abelem@ufpa.br
Aris Leivadeas, École de Technologie Supérieure, aris.leivadeas@etsmtl.ca
Atakan Aral, University of Vienna, atakan.aral@univie.ac.at
Attila Hilt, Nokia, attila.hilt@nokia.com
Augusto José Venâncio Neto, UNIVERSIDADE FEDERAL DO RIO GRANDE DO NORTE, augusto@dimap.ufrn.br
Carlos Becker Westphall, Federal Uiversity of Santa Catarina, westphal@inf.ufsc.br
Carlos Raniery Paula dos Santos, UNIVERSIDADE FEDERAL DE SANTA MARIA, csantos@inf.ufsm.br
Chadi Assi, Concordia University, assi@ciise.concordia.ca
Choong Seon Hong, Kyung Hee University, cshong@khu.ac.kr
Christian Esteve Rothenberg, UNIVERSIDADE ESTADUAL DE CAMPINAS, chesteve@dca.fee.unicamp.br
Costas Vassilakis, University of the Peloponnese, costas@uop.gr
Daniel Fernandes Macedo, UNIVERSIDADE FEDERAL DE MINAS GERAIS, damacedo@dcc.ufmg.br
Daphné Tuncer, Ecole des Ponts ParisTech, daphne.tuncer@enpc.fr
David Perez Abreu, University of Coimbra, dabreu@dei.uc.pt
Debora C. Muchaluat-Saade, UNIVERSIDADE FEDERAL FLUMINENSE, debora@midiacom.uff.br
Edmundo Madeira, UNIVERSIDADE ESTADUAL DE CAMPINAS, edmundo@ic.unicamp.br
Emil Lupu, Imperial College, e.c.lupu@imperial.ac.uk
Engin Zeydan, CTTC, engin.zeydan@cttc.cat
Ertan Onur, Middle East Technical University, eronur@metu.edu.tr
Filip De Turck, Ghent University - IMEC, filip.deturck@ugent.be
Fujun He, Huawei Technologies Co. Ltd., fujunhe@ieee.org
Fulvio Valenza, Politecnico di Torino, fulvio.valenza@polito.it
Gabi Dreo Rodosek, University of Federal Armed Forces, Munich, Gabi.Dreo@unibw.de
Giovanni Schembra, University of Catania, schembra@dieei.unict.it
Giuliano Casale, Imperial College London, g.casale@imperial.ac.uk
Hanan Lutfiyya, University of Western Ontario, hanan@csd.uwo.ca
Isabelle Chrisment, TELECOM Nancy - Université de Lorraine, isabelle.chrisment@loria.fr
Javier Baliosian, University of the Republic, baliosian@fing.edu.uy
Jeferson Campos Nobre, UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL, jcnobre@inf.ufrgs.br
Jérémie Leguay, Huawei, France Research Center, jeremie.leguay@gmail.com
Jiahai Yang, Tsinghua University, yang@cernet.edu.cn
Joe Betser, The Aerospace Corporation, jbetser@gmail.com
Joon-Myung Kang, Google, joonkang@google.com
Jorge E. López de Vergara, Universidad Autónoma de Madrid, jorge.lopez_vergara@uam.es
Jose Santos, Ghent University, josepedro.pereiradossantos@Ugent.be
Jose-Marcos Nogueira, UNIVERSIDADE FEDERAL DE MINAS GERAIS, jmarcos@dcc.ufmg.br
Juliano Araujo Wickboldt, UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL, julianowick@gmail.com
Laurent J. Lefevre, INRIA, laurent.lefevre@ens-lyon.fr
Leandro Navarro, Technical University of Catalonia, leandro@ac.upc.edu
Leonidas Lymberopoulos, PPC SA, l.lymperopoulos@dei.com.gr
Lianjie Cao, Hewlett Packard Labs, lianjie.cao@hpe.com
Luciano Paschoal Gaspary, UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL, paschoal@inf.ufrgs.br
Luis Carlos Erpen De Bona, Federal University of Parana, bona@inf.ufpr.br
Luiz Fernando Bittencourt, UNIVERSIDADE ESTADUAL DE CAMPINAS, bit@ic.unicamp.br
Marcus Brunner, Swisscom, marcus@brubers.org
Mario Di Mauro, University of Salerno, mdimauro@unisa.it
Masato Tsuru, Kyushu Institute of Technology, tsuru@cse.kyutech.ac.jp
Mauro Tortonesi, University of Ferrara, mauro.tortonesi@unife.it
Maxwell Young, Mississippi State University, maxwelly@outlook.com
Michael Bauer, University of Western Ontario, bauer@csd.uwo.ca
Michele Nogueira Lima, UNIVERSIDADE FEDERAL DE MINAS GERAIS, michele@dcc.ufmg.br
Muriel Figueredo Franco, Federal University of Rio Grande do Sul, franco@ifi.uzh.ch
Nakjung Choi, Nokia Bell Labs, nakjung.choi@nokia-bell-labs.com
Nur Zincir-Heywood, Dalhousie University, zincir@cs.dal.ca
Oscar Mauricio Caicedo, Universidad del Cauca, omcaicedo@unicauca.edu.co
Panagiotis Papadimitriou, University of Macedonia, papadimitriou@uom.edu.gr
Paulo Simoes, University of Coimbra, psimoes@dei.uc.pt
Pedro Martinez-Julia, NICT, pedro@nict.go.jp
Prasad Calyam, Columbia, calyamp@missouri.edu
Pratap Kumar Sahu, Foxconn, pratap.ksahu@gmail.com
Quanyan Zhu, New York University, quanyan.zhu@nyu.edu
Rafael Esteves, INSTITUTO FEDERAL DO RIO GRANDE DO SUL, rafesteves@gmail.com
Rafael Lopes Gomes, UNIVERSIDADE ESTADUAL DO CEARÁ, rafaellgom@gmail.com
Ramin Yahyapour, GWDG, Ramin.Yahyapour@gwdg.de
Remi Badonnel, University of Lorraine, remi.badonnel@loria.fr
Roberto Riggio, Università Politecnica delle Marche, roberto.riggio@gmail.com
Rodrigo Miani, UNIVERSIDADE FEDERAL DE UBERLÂNDIA, miani@ufu.br
Sand Luz Correa, UNIVERSIDADE FEDERAL DE GOIÁS, sand@inf.ufg.br
Sejun Song, University of Missouri Kansas City, sjsong@gmail.com
Shao Ying Zhu, Birmingham City University, peggy.zhu@bcu.ac.uk
Shie-Yuan Wang, National Yang Ming Chiao Tung University, shieyuan@cs.nctu.edu.tw
Slawomir Kuklinski, Orange Polska and Warsaw University of Technology, Warsaw, slawomir.kuklinski@gmail.com
Stefano Salsano, University of Rome Tor Vergata, stefano.salsano@uniroma2.it
Tiago Cruz, University of Coimbra, tjcruz@dei.uc.pt
Tim Wauters, Ghent University - IMEC, tim.wauters@ugent.be
Tsuyoshi Ide, IBM T. J. Watson Research Center, tide@us.ibm.com
Weverton Luis da Costa Cordeiro, UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL, wevertoncordeiro@gmail.com
Wolfgang Hommel, Universität der Bundeswehr München, wolfgang.hommel@unibw.de
Xuesong Qiu, Beijing University of Posts and Telecommunications, xsqiu@bupt.edu.cn
Yoshiaki Kiriha, Japan Science and Technology Agency, yoshiaki.kiriha@jst.go.jp
Young Choi, Regent University, ychoi@regent.edu